Source: Abstracts. Conference titles: Workshop on Semiconductors and Micro and Nano Technology - SEMINATEC. Unidade: EESC
Subjects: TRANSFERÊNCIA DE CALOR, CIRCUITOS INTEGRADOS, MICROELETRÔNICA, ENGENHARIA MECÂNICA
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ALVAREZ, H. S. et al. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture. 2021, Anais.. São Paulo, SP: SBMicro, 2021. Disponível em: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf. Acesso em: 16 maio 2024.APA
Alvarez, H. S., Cioldim, F. H., Silva, A. R., & Diniz, J. A. (2021). High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture. In Abstracts. São Paulo, SP: SBMicro. Recuperado de https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdfNLM
Alvarez HS, Cioldim FH, Silva AR, Diniz JA. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture [Internet]. Abstracts. 2021 ;[citado 2024 maio 16 ] Available from: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdfVancouver
Alvarez HS, Cioldim FH, Silva AR, Diniz JA. High aspect ratio silicon microchannel definition via ICP plasma etching using SF6/Ar as gas mixture [Internet]. Abstracts. 2021 ;[citado 2024 maio 16 ] Available from: https://repositorio.usp.br/directbitstream/af37cdf0-62e5-4e55-90a1-799f83a30bb5/PROD_26257_SYSNO_3153042.pdf
